Fan-out wafer-level packaging (FOWLP) is commonly used for manufacturing system-in-package components and multi-chip modules, where multiple integrated circuit dice can be combined in a common, ...
Abstract: It is difficult for a standing-wave waveguide slot array antenna to generate a complex beam shape in H-plane, such as the cosecant squared pattern. The reason is that a conventional standing ...
Velo3D [VELO], a developer of medal additive manufacturing solutions used in aerospace, defense and other industries, won a $32.6 million contract from the Defense Innovation Unit (DIU) to help the ...
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