Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
Abstract: Chip-on-wafer-on-substrate (CoWoS®) is an advanced packaging technology to make high performance computing (HPC) and artificial intelligence (AI) components. As a high-end system-in-package ...
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