Abstract: Ruthenium (Ru) and Copper (Cu) interface promotes void-free Cu gap-fill through a Cu reflow approach. However, reliability issues such as Electromigration (EM) and time-dependent dielectric ...

Abstract: Ruthenium (Ru) etch mechanisms, challenges, and progress are reviewed. Conventional Ru etch chemistries are limited and have substrate compatibility or toxic-material-release concerns.

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