Expanded collaboration combines agentic AI, physics-based simulation, and digital twins to accelerate engineering and unlock new levels of productivity across semiconductors, physical AI systems and ...
Abstract: High-linearity current-steering DACs are critical components in wireless and wireline communication systems, but are notoriously time-consuming to design. Nonlinearity from component ...
Abstract: Monolithic inter-tier vias (MIVs) in monolithic 3-D integrated circuits (M3D ICs) enables massive vertical integration. However, MIVs are more susceptible to defects due to high integration ...
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