Abstract: For 3D chiplets integration, a high aspect ratio through dielectric via (TDV) fabrication method has not been clearly established. This is because Si-O bonding is stronger than Si-Si bonding ...
Abstract: With the rapid advancement of optical communication technology, radio over free space optical (RoFSO) communication has demonstrated considerable potential in communication applications due ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results