AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the ...
IEEE

Targeted Black-Box Adversarial Example Generation Method Using Multi-Layer Heatmap Mapping for Industrial IoT

Abstract: Deep learning-based image classification models have been widely applied in the Industrial Internet of Things (IIoT), but studies have shown that adversarial attacks can cause ...
IEEE

A 0.81 mJ/frame, Real-time LiDAR Odometry and Mapping Processor with Memory-efficient kNN and Reconfigurable Architecture

Abstract: This paper proposes a low-latency and energy-efficient LiDAR Odometry and Mapping (LOAM) processor. The memory-efficient point matching core (PMC) with hash page-based memory management unit ...