The original circuit simulation software, called the Simulation Program with Integrated Circuit Emphasis, or SPICE as it is more commonly known, was originally developed at the University of ...

Advanced BCD technologies use deep trench isolation (DTI) to optimize area and to suppress parasitic effects in bi-polar junction transistors (BJTs). However, DTI increases thermal resistance and self ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

Discovering a design error after you send youraverage chip to manufacturing can be costlyand embarrassing, not to mention hazardous toyour career. However, as Intel ...

GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

CARY, NC--(Marketwire - Nov 7, 2012) - Coventor®, Inc., the leading supplier of design automation software for developing micro-electromechanical systems (MEMS), today introduced the MEMS+ ® 3.0 ...

MILPITAS, CA--(Marketwired - Aug 27, 2013) - Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today introduced the latest version ...

For simple circuits, it’s easy enough to grab a breadboard and start putting it together. Breadboards make it easy to check your circuit for mistakes before soldering together a finished product. But ...

MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, launched a brand-new scalable quantum Fourier transform simulator technology based on multi-FPGA and ...