Q: You have often written about the legal problems arising in the course of the host-IC relationship. If our agency were to design a hosting program and IC contract from scratch, what terms and ...

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered into the high-speed ...

The power-performance-area (PPA) metric and time-to-market of modern system-on-chips (SoCs) are dominated by two major issues: on-chip interconnects and layout parasitics. Especially, as the industry ...

Credence Systems has introduced the GlobalScan-I, an IC diagnostic system that performs physical device analysis to pinpoint process performance yield problems. The company claims that GlobalScan-I ...

Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are ...

G'day all,<P>I recently discovered the iC (internet Commit driver) program [/URL]iC Review<BR> that allows you to play Duke3D over the net or a tcp/ip network.<P>It installed and everything and I ...